Featured Case Study
Unicircuit, Inc. has established manufacturing guidelines that demonstrate an excellent cost vs. performance curve, repeatability, and proven reliability for DOD products, platforms, and applications.
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- .004 mil Laser defined vias
- .006 mil Drilled hole diameter
- .002 mil Line & Space
- .006 mil COB (chip on Board)
- .4mm pitch BGA packages
- Conductive (CB100 & Ormet) via fill
- Non Conductive (PHP-900, Peters 2795, and Taiyo THP 100) via fill
- Horizontal / Vertical Multi-Level Launch Sites
- Precision Back drilling
- Multi Sequential Lamination
- Fusion Bonding
- Core to Core Bonding
- Heatsink Bonding
- Teflon Metal back
- CIC / Copper core
- Heavy Copper / Thermal vias